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Laser can be divided into liquid laser, gas laser, and solid laser according to the medium of laser generation. The most common semiconductor laser is a kind of solid-state laser. Semiconductor lasers are electrically driven diodes.

We know that dry firing practice is one of the best ways to become a good marksman. The reason why choose dry firing training, mainly from the following aspects.

Laser technology has come a long way, and for now, the nuances of lasers and physics are looking at the quantum realm, a relatively new field of science with much to discover.

Laser TV is highly recognized in the consumer and industry with the help of good user experiences, such as ultra-high-definition picture quality, large screen for eye protection, good home integration, and cinema level immersion.

Semiconductor laser, commonly known as a laser diode, is composed of fiber coupling semiconductor laser module, beam combination device, laser energy transmission cable, power system, control system, ...

In many industrial applications, infrared lasers have very good results. However, for the processing of non-ferrous metals, especially copper, the absorption of non-ferrous metals to the laser is very...

There are many ways to classify semiconductor lasers. On the basis of the wavelength can be divided into the far-infrared laser, near-infrared laser, visible laser, ultraviolet laser, and other categories.

Fiber laser is a laser with rare-earth-doped glass fiber as a gain medium. Fiber lasers can be developed based on fiber amplifiers. Under the action of pumping light, the high power density is easily formed in the fiber ...

Lidar is an important sensor integrating laser, GPS positioning and inertial measurement device. Its wavelength is mainly located in the near infrared part of the electromagnetic spectrum (780nm, 808nm, 850nm, 940nm, 1064nm).

Laser processing refers to the use of laser beam projected on the surface of the thermal effect of the material to complete the processing process, including laser welding, laser cutting, surface modification, laser marking, laser drilling and micro machining.